Copper Fin with Aluminum Bottom Heat Sink For CPU

Application: CPU

Specification:

Overall Dimension: L56*W56*H26mm

Copper Fin Thickness: 0.4mm

Fin Quantity Per Row: 28 pcs * 16 pcs

Aluminum Bottom Wall Thickness:2mm

Part Weight: 56 Grams

Material:

Pure Copper C1100 Strips, Purity over 99.5%  (Standard: JIS H3250-2006);  Pure Aluminum Board A1060  Purity Over 99.6% .(Standard: GB/T3880-2006).

 Little Impurity brings very good Electrical and Heat Conduction; Excellent Performance In Corrosion Resistant as well.

Processing Technic:

1. Copper Fins: Progressive Die Stamping

2. Aluminum Enclosure and Board: Forming Die Stamping

3. Aluminum Board and Enclosure Nickle Plated,  Copper Fin Passivate (Insulation,

   Oxidation and Corrosion Resistance).

4. Assembly: Automatic Fin Wearing/Assembly, then Fixed by Overflow Soldering  and

   Screw/Rivet Combination.

6. Quality Check

7. Packing

Advantages:

1. Professional Research and Design Team,  Strong & Automatic Equipments: Progressive

  Stamping, Automatic Soldering Machine

2.  Strict Quality Control in Each Process and Finish Product Quality Control

3. Short Delivery Lead Time: 15-30 Days

4. Optional For OEM or ODM

5. Comprehensive After-Sale Service, Quick Responses For Daily Communication